Creative Led Display Expert | Led Display Solution Provider for The Commercial Market.
HOB - The LED screen technology employed by our company is HOB (Hotmet on Board)
The LED screen technology employed by our company is HOB (Hotmet on Board), an innovative process that achieves comprehensive coverage of LED chips by coating the screen surface with a protective layer composed of high-refractive-index nanomaterials. This protective layer not only effectively shields against external factors but also significantly enhances the stability and lifespan of the LED chips. Additionally, it brings dual improvements in quality and efficiency during the packaging process of LED displays.
Compared to the room-temperature dispensing process adopted by GOB technology, the high-temperature molding process of HOB technology demonstrates superior performance. It not only grants LED displays better thermal stability, precision, flatness, and thickness control capabilities but also effectively prevents the issue of glue cracking caused by heat generation during LED operation.
In terms of durability, HOB technology utilizes a COB process involving high-temperature molding of polymer synthetic colloids, incorporating various additives, coagulants, and UV stabilizers. This innovative design not only effectively avoids the problem of easy yellowing in ordinary epoxy resins but also further enhances product durability by adjusting the design of black pigments and the matte surface of the mold.
When we directly compare traditional GOB products with HOB products, the difference in their scratch resistance is particularly notable. Under the same screwdriver scratch test, the surface of GOB products quickly shows scratches and cracks, while HOB products remain intact. This advantage is also attributed to the COB process of high-temperature molding of polymer synthetic colloids adopted by HOB technology and its unique material formulation.
In terms of optical performance, products produced by the GOB process exhibit variable thickness characteristics, with differences in the flatness of their self-leveling colloid surfaces, leading to thicker GOB products. This characteristic is particularly problematic in large-scale tiling applications, highlighting the severity of edge refraction issues, commonly known as the bright line phenomenon that appears at certain writing angles. In contrast, the HOB process employs precision molding tools to accurately control its thickness, achieving a minimal difference of only 0.2 millimeters above the height of the LED components. This precise design effectively avoids secondary refraction of light at the edges of the colloid.
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HOB process. |
Description of the advantages of the HOB process. |
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Appearance |
Restore the granular feel of the LED beads |
The HOB process naturally forms a smooth granular surface through a one-time curing process, addressing the issues of planar mirror reflection and uneven micro-particles associated with the GOB process. |
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Consistency in ink color is excellent |
The HOB process utilizes a tunnel furnace for curing, eliminating the long curing cycle of the GOB process where the surface dries in 2-3 days but deep curing requires 3-6 months, which can lead to ink color differences. |
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Excellent flatness |
The HOB process employs fully automated equipment and specialized fixtures for vacuum filling and curing in a tunnel furnace, followed by fixture removal, which addresses the poor flatness issue associated with GOB's room-temperature curing process. |
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Uniform colloid thickness |
The HOB process has less light loss and better heat dissipation compared to the GOB process, mitigating the issue of reduced LED lifespan associated with the GOB process. |
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Display effect. |
The seams are seamless without light leakage |
The GOB mirror light source tends to cause light leakage at the seams, making it prone to modularization. |
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Improve ink color uniformity/shading balance |
The HOB process can improve ink color uniformity on black screens and balance shading when lit, eliminating the need for customers to select boards as they do with the GOB process. |
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Performance |
Resistant to high and low temperatures |
The HOB process demonstrates resilience to a wide temperature range of -20°C to +80°C. In contrast, the GOB process may result in module deformation at temperatures around -5°C. Moreover, screens utilizing the GOB process are susceptible to edge lifting issues in terms of white balance. |
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Adequately protect the LED chips |
The high-temperature curing process in the HOB technology causes the glue to retract, ensuring that the LED chips and their grooves will not experience pull-out issues over prolonged use. In contrast, the flat surface in the GOB technology, due to its longer curing time, is prone to pull-out phenomena and can lead to poor soldering of the LED chips after extended periods of use. |
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Production process |
Fully automated equipment |
HOB: 1. Integrated mold closing and forming controlled by an automatic line, with automatic image detection. 2. A 40-meter-long high-temperature automatic line takes 1.5 hours, ensuring reliable consistency. (Daily oven temperature testing and oven temperature profile charts are conducted, using the same management method as for SMT reflow ovens.) 3. Reduces production time and improves production delivery efficiency. |
